IC Interconnect, a wafer bumping service company, announces its lead-free bumping capabilities, available now as a standard service offering.
COLORADO SPRINGS, Colorado — IC Interconnect, a wafer bumping service company, announces its lead-free bumping capabilities, available now as a standard service offering.
Reducing harmful substances in the environment at the manufacturing source has become increasingly important. Current RoHS (Restrictions on Hazardous Substances) initiatives mandate that by July 1, 2006, all new electronic equipment put on the market in European Union member states shall not contain lead, mercury, cadmium or hexavalent chromium. The United States does not currently have any guidelines, but will be affected by global manufacturers making the lead-free transition.
IC Interconnect recognizes these global changes by offering bumping services with lead-free solder. "When processing with lead-free alloys, the electroless nickel UBM (under bump metallurgy) we employ is identical to our lead-based process," explains Dr. Scott Popelar, director of engineering at IC Interconnect. "Both flip chip devices and wafer level chip scale packages have been qualified by customers and are available as standard catalog part numbers in leaded and lead-free versions."
In 2001, the same UBM system ICI employed since 1998 was used in the development and qualification of the lead-free alloys available today. These alternatives fit into the existing assembly infrastructure, meet cost targets and are equal to or surpass current reliability requirements.
"The biggest concern with switching from lead-based solder alloys to lead-free was reliability. ICI has processed, assembled and tested these lead-free die in both consumer and automotive applications. In both cases, they exceeded reliability requirements," says Curt Erickson, president of IC Interconnect.
For more information on IC Interconnect's lead-free process, please visit http://www.icinterconnect.com/press/leadfree.htm.
Source: Business Wire, IC Interconnect
